ChipX Selects SynTest's VirtualScan . Scan/ATPG Tool
to Reduce Test Costs for Next Generation Large ASICs

VirtualScan architecture helps reduce scan-pin count on load boards and simplify product testing

Santa Clara, CA - September 29, 2004 - ChipX, the industry's premier fast turn-around-time (TAT) provider of Structured ASICs for over a decade, has announced that it has selected SynTest¯s VirtualScanâ, Scan/ATPG tool, to ensure the quality of its new generation of large ASIC designs and cut the cost of ASIC testing, by reducing the scan-test pin-count on load boards.

"We pride ourselves on offering our customers the lowest cost ASIC solutions and getting them to market faster than any other ASIC alternative", said Elie Massabki, Vice President of Marketing at ChipX. "Upgrading our Design for Test (DFT) tools with VirtualScanâ from SynTest is an important step towards our on-going effort to consistently upgrade our development and test capabilities with the most effective tools to service our customers."

"At SynTest, we strive to provide our customers with DFT solutions that allow our customers to produce high quality designs, but reduce semiconductor manufacturing test costs," commented Dr. Ravi Apte, VP Strategy and Business Development at SynTest. "We are very happy that we could provide ChipX with a solution that enables them to achieve high fault coverage on their large chips, yet allows them to reduce their test costs. ChipX are using our VirtualScan to combat rising test costs in a unique manner. We are promoting our VirtualScan as a scan/ATPG tool to generate XtremeCompact scan test data that reduces time and cost on the ATE, and many of our customers like ChipX are now reaping the benefits."

How ChipX benefits from the SynTest's VirtualScan
Since 1995, when ChipX emerged as a provider of ASIC solutions, in order to mitigate risk, the company decided to use SynTest DFT methodology, to ensure a predictable outcome, eliminate potential design flaws at the last minute, and achieve high fault coverage.

Today, ChipX faces dual challenges of not only having to achieve high fault coverage on structured ASIC designs that are much larger, more complex, and have lots of memory, but also of having to reduce design times and test costs to stay competitive.

To maintain high fault coverage on large designs, a proportionately large number of scan-chains are required, resulting in high pin counts for scan testing and high costs for load boards for testing on Automatic Test Equipment (ATE). For an ASIC solutions provider handling a multitude of chips per year, these costs quickly take on significant proportions.

SynTest's VirtualScan architecture allows ChipX to have a large number of scan flip-flops in their design, arranged in a large number of short scan-chains, but to significantly reduce . by a factor of five or more - the number of external scan chains that need to be connected to the ATE. Thus, the number of pins on the load boards for scan testing can be significantly reduced and consequently also the costs for the load boards.

Furthermore, VirtualScan generates XtremeCompact scan test data that reduces time and cost on the ATE.

About ChipX
ChipX is a leading manufacturer of high performance Structured ASICs (Application Specific Integrated Circuits). The company's innovative, patented technology consolidates wafer manufacture tooling, reduces time-to-market and minimizes the cost of initial production. The company's Structured ASIC technology is widely used in high-end consumer electronics, communications, automotive telematics, computing peripherals, industrial control, medical equipment and military/aerospace systems. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, founded in the U.S. in 1989. The company holds two subsidiaries: ChipX (Israel) Ltd., which performs engineering and product development functions, and ChipX UK Ltd., which manages European operations. For more information, visit the ChipX website at

About SynTest
SynTest Technologies, Inc., est. 1990, develops and markets advanced Design-for-Test (DFT) and Design-for-Debug/Diagnosis (DFD) tools throughout the world, to semiconductor companies, system houses and design service providers. The Company¯s products improve an electronic design's testability and fault coverage and result in reduced defect levels and reduced slippage in Time-to-Market (TTM). They also reduce overall design and test costs, by helping to reduce design iterations as well as the time and reloads on Automatic Test Equipment (ATE). These products include tools for logic BIST, memory BIST, boundary-scan synthesis, DFT testability analysis, VirtualScan synthesis and ATPG with XtremeCompact. test vectors, concurrent fault simulation, silicon debug and diagnosis. The company headquartered in Sunnyvale, California, has offices in China, Taiwan, Korea and Japan, and distributors in Europe and Asia including Israel. More information is available at

TurboCheck, TurboBIST-Memory, TurboBSD, TurboScan, VirtualScan, and XtremeCompact are trademarks of SynTest Technologies, Inc. All other trademarks are property of their respective owners.

ASIC: Application Specific Integrated Circuits
FPGA Field Programmable Gate Arrays
ATE: Automatic Test Equipment
IC: Integrated Circuits
ATPG: Automatic Test Program Generation
IDM: Integrated Device Manufacturer
BIST: Built-In Self-Test IP Intellectual Property
DFT: Design-for-Test
MNC: Multi-National Company
DFD: Design-for-Debug/Diagnosis
SoC: System-on-Chip
EDA: Electronic Design Automation
TTM: Time-to-Market

This press release contains forward-looking statements based on current information available to ChipX as of the date hereof. These statements are based on Management's current expectations and may ultimately prove to be incorrect or false. Factors which could cause future results to differ materially from the results discussed, implied, or forecasted in the forward-looking statements include delays in scheduled product availability dates (which could result from various occurrences including development or testing difficulties, software errors, shortages in appropriately skilled engineers and project management problems); the risks inherent in the commercialization of the Company's anticipated products and services; shifts in customer or market demand for the Company's anticipated products; the impact of competitive products and pricing; and possible disruptive effects of organizational changes, including retaining key personnel and coordinating operations. ChipX assumes no obligation to revise or update any forward-looking statements contained in this press release.

For more information:

ChipX contact info: Elise Wallworth,
Tel: 1-

SynTest contact info: Nayan Pradhan, Senior Marketing Manager,
Tel:1- 408-720-9956 ext. 301,